Chipboard panel for raised access floor INTEC
FLOOR SYSTEM PT

Modular panel made of chipboard, composed of wood-core particles bound together by heat-hardener resins Thickness available 30 mm and 38 mm. This type of panel is suitable for working environments where a medium level physical-mechanical performance is required. It is recommended with HPL-laminate or resilient top finishes. It is not convenient for areas affected by humidity and it is therefore advisable to limit the use of water as much as possible even for its maintenance.

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