The PU-based solvent-free assembly adhesive is specially designed for the secure and durable bonding of XPS thermal insulation boards and construction boards and can be use for all solid substrates. It is characterized by rapid curing and high coverage of approx. 10 linear meters per cartridge, thereby ensuring fast and economical work.
Product characteristics – JACKODUR® Assembly adhesive:
PU-based solvent-free adhesive
Very rapid curing and high bonding strength
Very broad coverage: approx. 10 linear meters/cartridge
Specially for gluing XPS thermal insulation boards and construction boards