Thermal insulation K-FAC® 19

mineralrigid panelwithout vapor barrier

THERMAFIBER K-FAC 19 high temperature board provides high strength stability and excellent workability. It is composed of mineral fiber and selected mineral additives. The density allows K-FAC 19 to meet a variety of installation requirements. An organic binder that will dissipate above approx 475°F is used for low temperature handling. On initial start-up, heat rise should not exceed 15°F per minute to allow the binder to dissipate without excessive temperature rise. This will occur only on the first startup and will not adversely affect the insulation value. An inorganic binder system allows K-FAC 19 to be used at service temperatures to a maximum of 1900ºF on the hot surface of the enclosed panel only. Not to be subjected to direct flame impingement as a hot face material. K-FAC 19 has a special additive that provides water repellency so that the board will not absorb moisture from adjacent refractory materials.